+
  • Reflow

Key words

Lead free reflow ovens


Product Video

  • Product Description
  • Product Video
  • Description

    Explorflow system reflow ovens have the thousands installation case in China, the end users covers from the Medical, military, automotive electronics, household electronics, LED, EMS contract manufacturers. Thanks to the experts thermal air reflow chamber in the oven system, the temperature uniformity is perfect for any PCBs without regardless of the PCB with many components. Our best electrical control system is not only providing the endurable electrical control but also offering the real-time monitoring the temperature in each zone, and giving the extremely immediately thermal compensations when the oven is handling the multi volume PCBs to guarantee the temperature in each zone will not be any temperature dropped down.

    Features

    1. Provide Maximum heat capacity to rapidly reach temperature setting points at low rates of power consumption within a short period of time. The special process champers design makes the air convection uniformly and temperature profile changeover easily.

    2. Profile spikes per zone is eliminated with better zone segregation and decrease cross flow. The nozzle plate design allow to cover the boards with hot air in all direction for good uniformity. 

    3. Our heater generate the desired temperature faster than any other reflow heat source and respond in less than half a second to temperature change of less than 0.1°C thus maintaining the highest level of temperature repeatability.

    4. ExplorFlow offers the flexible, controllable preheating zones within while your PCB is preheated and prepared for the actual soldering process. The individual zones can be controlled independently via fan frequency to assure the best possible process.

    5. The system is equipped with special nozzle pate for optimized heat transfer by means of uniform air flow over the PCBs. Flow speeds in the upper and lower heat zones can be separately controlled, assuring that your PCB is heated up thoroughly. 

    6. Our transport systems provide the perfect fit for your components regardless of the circuit board geometry. Transport lanes and speeds are variably adjustable and enable parallel soldering processes with lead-free or leaded soldering in one reflow system.

    7. The optional center support enables even the processing of large circuit boards or boards with a flexible base material with ease and prevents any sagging during the reflow soldering, thus guaranteeing a maximum degree of process stability.

    8. Cooling zone is achieved with 3 top zones and down zone allowing adjustable convection speed for desired cooling slope; Water chiller cooling system is optional;The fans in the individual zones, which can be controlled separately as an option, allow for accurate control, and cooling gradients can be correspondingly influenced. This assures stress-free cooling for your PCBs, for lead-free soldering as well.

    Model

    ExplorFlow-0601

    ExplorFlow-0803

    ExplorFlow-1003

    ExplorFlow-1203

    Dimension(L*W*H)mm

    4100*1430*1520

    5520*1430*1520

    6300*1400*1520

    7050*1400*1520

    Weight (kg)

    1800

    2500

    2700

    2900

    Heating zones

    Top 6+ bottom 6

    Top 8+ bottom 8

    Top 10+bottom 10

    Top 12+bottom 12

    Heating Length(mm)

    2359

    3121

    3891

    4706

    cooling zones

    Top 2+ down 2

    Top 3 + Down 3

    Fixed lane

    Front lane

    Nozzle plate

    High quality  aluminum plate with special surface treatment

    Flux management

    Standard configuration

    Exhaust volume

    11CBM/min *2 channel exhaust

    Power supply

    3 phase ,380V 50/60Hz ( optional : 3 phase ,220V 50/60Hz)

    Total Power

    47KW

    64KW

    80KW

    92KW

    Startup power

    22KW

    30KW

    36KW

    42KW

    Power consumption

    6KW

    9KW

    10KW

    11KW

    Warming time

    From the normal temp. to set temp, approximate 30 minutes.

    Temp.

    setting range

    Room temperature to 300°C

    Temperature control method

    PID Close loop control +SSR Driving

    Temperature control precision

    +/- 1.0 °C

    Temperature deviation

    +/- 1.5°C

    Max. PCB width

    400mm ( Optional 610mm )

    Range of rail width

    50mm -400mm (optional 50mm -610mm )

    Components clearance

    Top/Bottom clearance of PCB : 25mm

    Conveyor direction

    L to R ( Optional R to L )

    Conveyor width adjust

    Motorized type ( Optional: software control automatic type )

    Chain  pin

    Standard: 5mm, the chain is anti-stuck type, solve the soldering problem of small PCB

    Standard  conveyor

    Rail+Chain + Mesh

    Conveyor speech

    300mm /min-2000mm / min

    Lubrication

    Auto-lubrication by software setting + Manual-lubrication

    Software

    Real time monitor, Production database, alarm list, temperature profile call for

    Optional

    Full N2 system, Center support system ,KIC RPI  reflow process inspection ,Dual lane

Lead free reflow ovens

  • Product Description
  • Product Video
  • Description

    Explorflow system reflow ovens have the thousands installation case in China, the end users covers from the Medical, military, automotive electronics, household electronics, LED, EMS contract manufacturers. Thanks to the experts thermal air reflow chamber in the oven system, the temperature uniformity is perfect for any PCBs without regardless of the PCB with many components. Our best electrical control system is not only providing the endurable electrical control but also offering the real-time monitoring the temperature in each zone, and giving the extremely immediately thermal compensations when the oven is handling the multi volume PCBs to guarantee the temperature in each zone will not be any temperature dropped down.

    Features

    1. Provide Maximum heat capacity to rapidly reach temperature setting points at low rates of power consumption within a short period of time. The special process champers design makes the air convection uniformly and temperature profile changeover easily.

    2. Profile spikes per zone is eliminated with better zone segregation and decrease cross flow. The nozzle plate design allow to cover the boards with hot air in all direction for good uniformity. 

    3. Our heater generate the desired temperature faster than any other reflow heat source and respond in less than half a second to temperature change of less than 0.1°C thus maintaining the highest level of temperature repeatability.

    4. ExplorFlow offers the flexible, controllable preheating zones within while your PCB is preheated and prepared for the actual soldering process. The individual zones can be controlled independently via fan frequency to assure the best possible process.

    5. The system is equipped with special nozzle pate for optimized heat transfer by means of uniform air flow over the PCBs. Flow speeds in the upper and lower heat zones can be separately controlled, assuring that your PCB is heated up thoroughly. 

    6. Our transport systems provide the perfect fit for your components regardless of the circuit board geometry. Transport lanes and speeds are variably adjustable and enable parallel soldering processes with lead-free or leaded soldering in one reflow system.

    7. The optional center support enables even the processing of large circuit boards or boards with a flexible base material with ease and prevents any sagging during the reflow soldering, thus guaranteeing a maximum degree of process stability.

    8. Cooling zone is achieved with 3 top zones and down zone allowing adjustable convection speed for desired cooling slope; Water chiller cooling system is optional;The fans in the individual zones, which can be controlled separately as an option, allow for accurate control, and cooling gradients can be correspondingly influenced. This assures stress-free cooling for your PCBs, for lead-free soldering as well.

    Model

    ExplorFlow-0601

    ExplorFlow-0803

    ExplorFlow-1003

    ExplorFlow-1203

    Dimension(L*W*H)mm

    4100*1430*1520

    5520*1430*1520

    6300*1400*1520

    7050*1400*1520

    Weight (kg)

    1800

    2500

    2700

    2900

    Heating zones

    Top 6+ bottom 6

    Top 8+ bottom 8

    Top 10+bottom 10

    Top 12+bottom 12

    Heating Length(mm)

    2359

    3121

    3891

    4706

    cooling zones

    Top 2+ down 2

    Top 3 + Down 3

    Fixed lane

    Front lane

    Nozzle plate

    High quality  aluminum plate with special surface treatment

    Flux management

    Standard configuration

    Exhaust volume

    11CBM/min *2 channel exhaust

    Power supply

    3 phase ,380V 50/60Hz ( optional : 3 phase ,220V 50/60Hz)

    Total Power

    47KW

    64KW

    80KW

    92KW

    Startup power

    22KW

    30KW

    36KW

    42KW

    Power consumption

    6KW

    9KW

    10KW

    11KW

    Warming time

    From the normal temp. to set temp, approximate 30 minutes.

    Temp.

    setting range

    Room temperature to 300°C

    Temperature control method

    PID Close loop control +SSR Driving

    Temperature control precision

    +/- 1.0 °C

    Temperature deviation

    +/- 1.5°C

    Max. PCB width

    400mm ( Optional 610mm )

    Range of rail width

    50mm -400mm (optional 50mm -610mm )

    Components clearance

    Top/Bottom clearance of PCB : 25mm

    Conveyor direction

    L to R ( Optional R to L )

    Conveyor width adjust

    Motorized type ( Optional: software control automatic type )

    Chain  pin

    Standard: 5mm, the chain is anti-stuck type, solve the soldering problem of small PCB

    Standard  conveyor

    Rail+Chain + Mesh

    Conveyor speech

    300mm /min-2000mm / min

    Lubrication

    Auto-lubrication by software setting + Manual-lubrication

    Software

    Real time monitor, Production database, alarm list, temperature profile call for

    Optional

    Full N2 system, Center support system ,KIC RPI  reflow process inspection ,Dual lane

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